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    ●BGA IC Package Assembly.
    ●SSD/M2 Module Assembly.
    ●uSD Card  for 1 to 4 flash stack and more.
    ●UDP Module  for 1 to 4 flash stack and more.
    ●Providing Customer own package solution, substrate/circuit design, optimization package process.
    ●Not only providing Micro SD, UPD, BGA ..etc package service, but also Flash Storage products.

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